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Intel International Science and Engineering Fair 2015 2015-05-18

Chow Hin Fung of 5D was awarded Fourth Award of 500USD for Revolutionary Recycled & Reusable Biodegradable Adhesive Tack (3R-BAT) in Environmental Engineering at this year’s Intel International Science and Engineering Fair (Intel ISEF)(英特爾國際科學與工程大獎賽) held in May (9/5 – 16/5) in Pittsburgh, USA.

This year’s Intel International Science and Engineering Fair featured more than approximately 1,700 young scientists in 1356 projects selected from 422 affiliate fairs in more than 75 countries, regions and territories.

Intel ISEF 2015 Grand Awards Ceremony
Announcement for Chow Hin Fung Yi at 32:58.
















































































































































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